[Photo News] SK hynix breaks ground on AI packaging hub

SK hynix held a groundbreaking ceremony Wednesday for its P&T7 advanced packaging facility in Cheongju, North Chungcheong Province. The fab will focus on advanced packaging for next-generation AI memory, such as high-bandwidth memory, a key step in boosting performance. The project, valued at about 19 trillion won ($13.7 billion), will be built on a 230,000-square-meter site with a cleanroom area of roughly 150,000 square meters. (SK hynix)

By The Korea Herald