Samsung reveals HBM5 mockup in bid to regain AI memory lead

Samsung Electronics unveiled a mockup of its HBM5 memory and a new heat-management technology at Computex 2026, signaling its ambition to regain momentum in the artificial intelligence memory race as competition with SK hynix intensifies. At the annual technology exhibition in Taiwan on Tuesday, Samsung showcased the planned architecture of its seventh-generation high-bandwidth memory, or HBM5, featuring a new thermal solution called Heat Path Block designed to improve heat dissipation in increa

By The Korea Herald