OCI secures $125m IFC funding for chip materials plant

OCI Holdings said Monday its Malaysian unit, OCI TerraSus, has secured a $125 million financing agreement with the International Finance Corporation, the private-sector arm of the World Bank Group. The funding will support the construction and operation of a semiconductor materials plant in Sarawak, developed by OCI Tokuyama Semiconductor Materials, a 50-50 joint venture between OCI TerraSus and Tokuyama Corporation. Located in Bintulu, the facility will produce ultra-high-purity, semiconductor-

By The Korea Herald